Patents/Inventors

Liang Wan

ChengduCN16 patents

14 Patents

US126129082026
Pumping Control Method and Apparatus, Material Distribution Method and Apparatus as Well as Distribution Device
ZOOMLION HEAVY INDUSTRY SCIENCE AND TECHNOLOGY CO., Ltd.
0 cites
US124944502025
Multi-layer Semiconductor Package with Stacked Passive Components
TEXAS INSTRUMENTS INCORPORATED
0 cites
US124069152025
Plated Metal Layer in Power Packages
Texas Instruments Incorporated
0 cites
US123228562025
Antenna in Package Having Antenna on Package Substrate
TEXAS INSTRUMENTS INCORPORATED
0 cites
US122118002025
Semiconductor Package with Shunt and Patterned Metal Trace
TEXAS INSTRUMENTS INCORPORATED
0 cites
US121671252024
Active Camera Relocation Method Having Robustness to Illumination
TIANJIN UNIVERSITY
0 cites
US121659892024
Semiconductor Package with Electromagnetic Interference Shielding
TEXAS INSTRUMENTS INCORPORATED
0 cites
US119787092024
Integrated System-in-package with Radiation Shielding
TEXAS INSTRUMENTS INCORPORATED
0 cites
US119708692024
Pump Truck Boom Control Method, Pump Truck Boom Control System and Pump Truck
ZOOMLION HEAVY INDUSTRY SCIENCE AND TECHNOLOGY CO., Ltd.
0 cites
US119012712024
High Current Packages with Reduced Solder Layer Count
TEXAS INSTRUMENTS INCORPORATED
0 cites
US117841142023
Plated Metal Layer in Power Packages
TEXAS INSTRUMENTS INCORPORATED
0 cites
US116212322023
Semiconductor Package with Electromagnetic Interference Shielding
Texas Instruments Incorporated
0 cites
US115878992023
Multi-layer Semiconductor Package with Stacked Passive Components
Texas Instruments Incorporated
0 cites
US115454202023
High Current Packages with Reduced Solder Layer Count
Texas Instruments Incorporated
0 cites