102 Patents
- US126105792026Semiconductor Device and Method of Forming Thereof
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US125687752026Method for Forming a Memory Device at a Backside of a Wafer Substrate, and Memory Cell Including a Memory Device at a Backside of a Wafer Substrate
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
- US125576432026Semiconductor Device Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US125503702026Semiconductor Device and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US125325092026Integrated Circuit with Backside Trench for Nanosheet Removal
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US125325052026Semiconductor Structure and Method for Forming the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US125060662025Field Effect Transistor with Source/drain via and Method
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US125001422025Semiconductor Devices Including Through Vias and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US125016712025Semiconductor Device and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US124842542025Integrated Circuit Structure with Backside via Rail
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US124630922025Semiconductor Device with Air Gaps and Method of Fabrication Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US124577942025Dual Side Contact Structures for Source/drain Regions in Semiconductor Transistor Devices and Method of Forming
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US124329752025Semiconductor Device with Backside Power Rail
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US124244842025Spacers for Semiconductor Devices Including Backside Power Rails
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US124244862025Integrated Circuit Structure with Backside Interconnection Structure Having Air Gap
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US124127812025Method for Forming a Contact Plug by Bottom-up Metal Growth
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US124143622025Fins Disposed on Stacks of Nanostructures Where the Nanostructures Are Wrapped Around by a Gate
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123962332025Semiconductor Device Having Backside via and Method of Fabricating Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US123879732025Semiconductor Device Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US123896182025Semiconductor Transistor Device Includes Backside via Electrically Connecting Epitaxial Source/drain Structures and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US123827102025Method for Forming Long Channel Back-side Power Rail Device
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123693652025Semiconductor Devices with Backside Power Rail and Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US123639642025Semiconductor Device Having Dielectric Hybrid Fin
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US123639392025Semiconductor Device with Backside Power Rail and Methods of Fabrication Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US123639462025Source/drain Contacts and Methods of Forming Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123362152025Semiconductor Device Structure and Method for Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123289172025Semiconductor Structure Having Second Contact Structure Over Second Side of First S/D Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123241822025Connector via Structures for Nanostructures and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US123005362025Glue Layer Etching for Improving Device Performance and Providing Contact Isolation
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - 0 cites
- US123007222025Selective Liner on Backside via and Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - 0 cites
- US122835212025Methods of Forming Spacers for Semiconductor Devices Including Backside Power Rails
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US122782732025Semiconductor Device with Backside Gate Isolation Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US122665632025Enlarging Contact Area and Process Window for a Contact Via
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122667002025Semiconductor Nanostructures Device Structure with Backside Contact
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US122551032025Semiconductor Structure with Backside via Contact and a Protection Liner Layer
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US122437812025Semiconductor Device with L-shape Conductive Feature and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACUTRING CO., Ltd.
0 cites - US122243252025Semiconductor Device and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - 0 cites
- US121702452024Contact Features and Methods of Fabricating the Same in Fin Field-effect Transistors (finfets)
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd
0 cites - US121660922024Method for Forming Source/drain Contacts Utilizing an Inhibitor
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US121599022024Semiconductor Device Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACURING COMPANY, Ltd.
0 cites - US121488052024Semiconductor Structure with Wraparound Backside Amorphous Layer
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
- US121258522024Multi-gate Transistors with Backside Power Rail and Reduced Gate-drain Capacitance
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US121070112024Method for Fabricating a Semiconductor Device
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US121006562024Backside Connection Structures for Nanostructures and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US120949422024Butted Contacts and Methods of Fabricating the Same in Semiconductor Devices
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US120878602024Methods of Forming Contact Features in Field-effect Transistors
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US120806462024Semiconductor Structures and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US120683822024Dumbbell Shaped Self-aligned Capping Layer Over Source/drain Contacts and Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US120465072024Semiconductor Device Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120465162024Semiconductor Device with Gate Cut Feature and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120466442024Gap Spacer for Backside Contact Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120274142024Using a Liner Layer to Enlarge Process Window for a Contact Via
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US120210252024Contact Features and Methods of Fabricating the Same in Semiconductor Devices
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US120211192024Selective Liner on Backside via and Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - 0 cites
- US120093942024Source/drain Contacts and Methods of Forming Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
- US119843502024Integrated Circuit Structure with Backside Interconnection Structure Having Air Gap
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US119787732024Formation Method of Semiconductor Device Structure with Semiconductor Nanostructures
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US119555152024Dual Side Contact Structures in Semiconductor Devices
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US119555522024Semiconductor Device with Backside Power Rail and Methods of Fabrication Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US119488792024Semiconductor Device Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US119357942024Method for Forming Long Channel Back-side Power Rail Device
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119293212024Method for Forming via Structure Having Low Interface Resistance
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119234082024Semiconductor Devices with Backside Power Rail and Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US119159722024Methods of Forming Spacers for Semiconductor Devices Including Backside Power Rails
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - 0 cites
- US119014232024Capacitance Reduction for Backside Power Rail Device
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US119014282024Semiconductor Device with Backside Gate Isolation Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US118625592024Semiconductor Structures and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US118548662023Enlarging Contact Area and Process Window for a Contact Via
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US118483722023Method and Structure for Reducing Source/drain Contact Resistance at Wafer Backside
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US118307692023Semiconductor Device with Air Gaps and Method of Fabrication Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US118044862023Backside Power Rail and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - 0 cites
- US117842332023Integrated Circuit Structure with Backside via Rail
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US117770032023Semiconductor Structure with Wraparound Backside Amorphous Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117696962023Method for Fabricating a Semiconductor Device
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US117497282023Semiconductor Device and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US117423852023Selective Liner on Backside via and Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US117282112023Semiconductor Device Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US117216232023Backside Connection Structures for Nanostructures and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - US117157642023Semiconductor Device Structure and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US117106642023Semiconductor Structure with Backside via Contact and a Protection Liner Layer
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US116827072023Contact Formation Method and Related Structure
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US116827302023Connector via Structures for Nanostructures and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - 0 cites
- US116706912023Method for Forming Source/drain Contacts Utilizing an Inhibitor
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US116642782023Semiconductor Device with L-shape Conductive Feature and Methods of Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - 0 cites
- US116211972023Semiconductor Device with Gate Cut Feature and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US116212242023Contact Features and Methods of Fabricating the Same in Semiconductor Devices
TAIWAN SEMICONDUCTOR MANUFACTURING Co. Ltd.
0 cites - US115946022023Butted Contacts and Methods of Fabricating the Same in Semiconductor Devices
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - 0 cites
- US115812242023Method for Forming Long Channel Back-side Power Rail Device
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US115575102023Spacers for Semiconductor Devices Including Backside Power Rails
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US115519692023Integrated Circuit Structure with Backside Interconnection Structure Having Air Gap
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites