Li-sheng Weng

12 Patents

• US126047402026

  Chip Package with Integrated Embedded Off-die Inductors

  XILINX, Inc.

  0 cites
• US124827152025

  Chip Package with Core Embedded Integrated Passive Device

  XILINX, Inc.

  0 cites
• US124698112025

  Package Comprising Wire Bonds Coupled to Integrated Devices

  QUALCOMM INCORPORATED

  0 cites
• US124631432025

  Chip Package with Core Embedded Integrated Devices

  XILINX, Inc.

  0 cites
• US124314162025

  Chip Package with Integrated Current Control

  XILINX, Inc.

  0 cites
• US123549782025

  Coupled Loop and Void Structure Integrated in a Redistribution Layer of a Chip Package

  XILINX, Inc.

  0 cites
• US123550002025

  Package Comprising a Substrate and a High-density Interconnect Integrated Device

  QUALCOMM INCORPORATED

  0 cites
• US121366132024

  Chip Package with Near-die Integrated Passive Device

  XILINX, Inc.

  0 cites
• US117841572023

  Package Comprising Integrated Devices Coupled Through a Metallization Layer

  QUALCOMM INCORPORATED

  0 cites
• US116769222023

  Integrated Device Comprising Interconnect Structures Having an Inner Interconnect, a Dielectric Layer and a Conductive Layer

  QUALCOMM INCORPORATED

  0 cites
• US116055942023

  Package Comprising a Substrate and a High-density Interconnect Integrated Device Coupled to the Substrate

  QUALCOMM INCORPORATED

  0 cites
• US115944912023

  Multi-die Interconnect

  QUALCOMM INCORPORATED

  0 cites