Patents/Inventors

Li-feng Teng

HsinchuTW15 patents

16 Patents

US125074712025
Semiconductor Device and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US124395942025
Semiconductor Device and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US123896722025
Method to Embed Planar Fets with Finfets
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123227152025
Method of Forming Integrated Chip Structure Having Slotted Bond Pad in Stacked Wafer Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122551332025
Electrical Fuse (e-fuse) One-time Programmable (OTP) Device and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US121273992024
Array Boundary Structure to Reduce Dishing
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120966212024
Multi-type High Voltage Devices Fabrication for Embedded Memory
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120588562024
Semiconductor Device and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US120150292024
Method to Embed Planar Fets with Finfets
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118308752023
Method to Embed Planar FETS with FINFETS
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118256512023
Semiconductor Device and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US117587212023
Semiconductor Device and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US117423482023
Semiconductor Device and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US117069142023
Method of Forming an Array Boundary Structure to Reduce Dishing
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US116006182023
Integrated Circuit Structure and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US115946202023
Semiconductor Device and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites