23 Patents
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- US126106392026Semiconductor Package Structure and Method for Producing the Same
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites - US126044202026Sensor Package Structure and Manufacturing Method Thereof
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites - US125988212026Chip Package Structure and Method for Producing the Same
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites - US125752042026Sensor Package Structure and Manufacturing Method Thereof
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites - US125385982026Chip Package Structure and Method for Fabricating the Same
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
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- US124179922025Chip Structure with Conductive Pillar and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
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- US123567422025Chip Packaging Structure and Chip Packaging Method
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites - US122243592025Sensor Package Structure Having Solder Mask Frame
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites - 0 cites
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- US121744462024Sensor Lens Assembly Having Non-soldering Configuration
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites - 0 cites
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- US121085172024Sensor Lens Assembly Having Non-soldering Configuration
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites - 0 cites
- US119845162024Sensor Package Structure Having Ring-shaped Solder Mask Frame
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites - US119676522024Sensor Package Structure Having Solder Mask Frame
TONG HSING ELECTRONIC INDUSTRIES, Ltd.
0 cites - US116887082023Chip Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites