Li-chieh Wu

9 Patents

• US125506952026

  Methods of Forming an Abrasive Slurry and Methods for Chemical-mechanical Polishing

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US125060342025

  Polishing Interconnect Structures in Semiconductor Devices

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US122973752025

  Slurry Composition and Method for Polishing and Integrated Circuit

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.

  0 cites
• US120681952024

  Metal Loss Prevention Using Implantation

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US120026842024

  Methods for Chemical Mechanical Polishing and Forming Interconnect Structure

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.

  0 cites
• US119962832024

  Method for Metal Gate Surface Clean

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US119786642024

  Polishing Interconnect Structures in Semiconductor Devices

  TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.

  0 cites
• US117106592023

  Metal Loss Prevention Using Implantation

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.

  0 cites
• US116580652023

  Chemical Mechanical Polishing Slurry Composition, Method for Chemical Mechanical Polishing and Method for Forming Connecting Structure

  TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.

  0 cites