Patents/Inventors

Leonel Arana

Phoenix, AZUS19 patents

12 Patents

US126160522026
Methods and Apparatus to Reduce Defects in Interconnects Between Semicondcutor Dies and Package Substrates
Intel Corporation
0 cites
US126047442026
Integration of Glass Core Into Electronic Substrates for Fine Pitch Die Tiling
Intel Corporation
0 cites
US124567052025
First Layer Interconnect First on Carrier Approach for EMIB Patch
Intel Corporation
0 cites
US124496002025
Position Controlled Waveguides and Methods of Manufacturing the Same
Intel Corporation
0 cites
US123549922025
First Layer Interconnect First on Carrier Approach for EMIB Patch
Intel Corporation
0 cites
US123411172025
Methods and Apparatus to Reduce Defects in Interconnects Between Semiconductor Dies and Package Substrates
Intel Corporation
0 cites
US123344222025
Methods and Apparatus to Reduce Defects in Interconnects Between Semicondcutor Dies and Package Substrates
Intel Corporation
0 cites
US122551302025
Airgap Structures for High Speed Signal Integrity
Intel Corporation
0 cites
US120339302024
Selectively Roughened Copper Architectures for Low Insertion Loss Conductive Features
Intel Corporation
0 cites
US120274662024
Conductive Route Patterning for Electronic Substrates
Intel Corporation
0 cites
US119488482024
Subtractive Etch Resolution Implementing a Functional Thin Metal Resist
Intel Corporation
0 cites
US118173492023
Conductive Route Patterning for Electronic Substrates
Intel Corporation
0 cites