Leo Van Gemert

7 Patents

• US126222802026

  Semiconductor Device with Through Package via and Method Therefor

  NXP USA, Inc.

  0 cites
• US125885572026

  Multichip Packages with 3D Integration

  NXP USA, Inc.

  0 cites
• US125388442026

  Double-sided Multichip Packages

  NXP USA, Inc.

  0 cites
• US124763552025

  System

  NXP B.V.

  0 cites
• US121835952024

  Selective Underfill Assembly and Method Therefor

  NXP B.V.

  0 cites
• US119632912024

  Efficient Wave Guide Transition Between Package and PCB Using Solder Wall

  NXP B.V.

  0 cites
• US115574912023

  Selective Underfill Assembly and Method Therefor

  NXP B.V.

  0 cites