5 Patents
- US125123802025Semiconductor Packages Including a Package Body with Grooves Formed Therein
Infineon Technologies AG
0 cites - US120947932024Package with Electrically Insulated Carrier and at Least One Step on Encapsulant
Infineon Technologies AG
0 cites - US118760282024Package with Electrically Insulated Carrier and at Least One Step on Encapsulant
Infineon Technologies AG
0 cites - US118044242023Method for Fabricating a Semiconductor Device by Using Different Connection Methods for the Semiconductor Die and the Clip
Infineon Technologies Austria AG
0 cites - US116768812023Semiconductor Package, Semiconductor Assembly and Method for Fabricating a Semiconductor Package
Infineon Technologies AG
0 cites