5 Patents
- US118814632024Coreless Organic Packages with Embedded Die and Magnetic Inductor Structures
Intel Corporation
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- US116107062023Release Layer-assisted Selective Embedding of Magnetic Material in Cored and Coreless Organic Substrates
Intel Corporation
0 cites - US115748742023Package Architecture Utilizing Photoimageable Dielectric (PID) for Reduced Bump Pitch
Intel Corporation
0 cites