Patents/Inventors

Lakshmipriya Seshan

Sunnyvale, CAUS17 patents

17 Patents

US125917272026
Lane Repair and Lane Reversal Implementation for Die-to-die (D2D) Interconnects
Intel Corporation
0 cites
US125546722026
Link Layer-phy Interface Adapter
Intel Corporation
0 cites
US124990192025
Retimers to Extend a Die-to-die Interconnect
Intel Corporation
0 cites
US124990742025
Die-to-die Interconnect Protocol Layer
Intel Corporation
0 cites
US124816142025
Standard Interfaces for Die to Die (D2D) Interconnect Stacks
Intel Corporation
0 cites
US124685972025
Valid Signal for Latency Sensitive Die-to-die (D2D) Interconnects
Intel Corporation
0 cites
US124059122025
Link Initialization Training and Bring Up for Die-to-die Interconnect
Intel Corporation
0 cites
US123609342025
Parameter Exchange for a Die-to-die Interconnect
Intel Corporation
0 cites
US123623062025
Clock-gating in Die-to-die (D2D) Interconnects
Intel Corporation
0 cites
US123533052025
Compliance and Debug Testing of a Die-to-die Interconnect
Intel Corporation
0 cites
US123328262025
Die-to-die Interconnect
Intel Corporation
0 cites
US123213052025
Sideband Interface for Die-to-die Interconnects
Intel Corporation
0 cites
US123163432025
Phy-based Retry Techniques for Die-to-die Interfaces
Intel Corporation
0 cites
US122988332025
Performance Level Control in a Data Processing Apparatus
Intel Corporation
0 cites
US121598402024
Scalable and Interoperable PHYLESS Die-to-die IO Solution
Intel Corporation
0 cites
US121179602024
Approximate Data Bus Inversion Technique for Latency Sensitive Applications
Intel Corporation
0 cites
US119718412024
Link Layer-phy Interface Adapter
Intel Corporation
0 cites