18 Patents
- 0 cites
- US125060842025Methods of Fabricating Substrates with Thermal Vias and Sinter-bonded Thermal Dissipation Structures
NXP USA, Inc.
0 cites - US125064462025Power Amplifier Modules Including Topside Cooling Interfaces and Methods for the Fabrication Thereof
NXP USA, Inc.
0 cites - 0 cites
- US124701832025Power Amplifier Modules, Systems, and Substrates Containing Field Trapper Structures
NXP USA, Inc.
0 cites - 0 cites
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- US120402912024Radio Frequency Packages Containing Multilevel Power Substrates and Associated Fabrication Methods
NXP USA, Inc.
0 cites - US120149712024Thermal Interface Structures, Electrical Systems with Thermal Interface Structures, and Methods of Manufacture Thereof
NXP USA, Inc.
0 cites - 0 cites
- US119908722024Power Amplifier Modules Including Topside Cooling Interfaces and Methods for the Fabrication Thereof
NXP USA, Inc.
0 cites - US119844292024Leadless Power Amplifier Packages Including Topside Termination Interposer Arrangements and Methods for the Fabrication Thereof
NXP USA, Inc.
0 cites - 0 cites
- US117496392023Die-substrate Assemblies Having Sinter-bonded Backside via Structures and Associated Fabrication Methods
NXP USA, Inc.
0 cites - US116212282023Substrate with Thermal Vias and Sinter-bonded Thermal Dissipation Structure
NXP USA, Inc.
0 cites - US116212312023Methods of Fabricating Leadless Power Amplifier Packages Including Topside Terminations
NXP USA, Inc.
0 cites - US116216732023Power Amplifier Packages and Systems Incorporating Design-flexible Package Platforms
NXP USA, Inc.
0 cites