11 Patents
- 0 cites
- US123947132025Fabric Die to Fabric Die Interconnect for Modularized Integrated Circuit Devices
Altera Corporation
0 cites - US123344492025Selective Use of Different Advanced Interface Bus with Electronic Chips
Altera Corporation
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- US120260082024Techniques for Clock Signal Transmission in Integrated Circuits and Interposers
Altera Corporation
0 cites - US120092982024Fabric Die to Fabric Die Interconnect for Modularized Integrated Circuit Devices
Intel Corporation
0 cites - US117269322023Network-on-chip for Inter-die and Intra-die Communication in Modularized Integrated Circuit Devices
Intel Corporation
0 cites - 0 cites
- US116694722023Frequency Translation Circuitry for an Interconnection in an Active Interposer of a Semiconductor Package
Intel Corporation
0 cites - US116705892023Fabric Die to Fabric Die Interconnect for Modularized Integrated Circuit Devices
Intel Corporation
0 cites - US116217132023High-speed Core Interconnect for Multi-die Programmable Logic Devices
Intel Corporation
0 cites