Patents/Inventors

Kyuwon Lee

Kyunggi-doKR2 patents

3 Patents

US122117782025
Semiconductor Device and Method of Forming Bump Pad Array on Substrate for Ground Connection for Heat Sink/shielding Structure
STATS Chippac Pte. Ltd.
0 cites
US117757292023
Technology File Process Rule Validation
Samsung Electronics Co., Ltd.
0 cites
US117641362023
Semiconductor Device and Method of Forming Bump Pad Array on Substrate for Ground Connection for Heat Sink/shielding Structure
STATS Chippac Pte. Ltd.
0 cites