Patents/Inventors

Kyungsuk Oh

Seongnam-siKR9 patents

10 Patents

US123880482025
Semiconductor Package Comprising Heat Spreader
Samsung Electronics Co., Ltd.
0 cites
US122372682025
Integrated Circuit Semiconductor Device
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122118292025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121990022025
Semiconductor Package and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120574412024
Semiconductor Package Including a Plurality of Semiconductor Chips
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120093032024
Integrated Circuit Semiconductor Device
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119963982024
Semiconductor Package and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US119844212024
Integrated Circuit Chip Having BS-PDN Structure
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117423292023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116316602023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites