17 Patents
- US126157432026Electronic Device Comprising Thermal Management Chamber Using Boiling
Samsung Electronics Co., Ltd.
0 cites - US125404022026Electronic Device Including Outer Housing Plated with Conductive Member and Manufacturing Method Therefor
INTOPS. CO., Ltd
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- US124365822025Heat Radiating Member and Electronic Device Including Same
Samsung Electronics Co., Ltd.
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- US119907862024Electronic Device and Method for Controlling Cooling Function of External Electronic Device
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- US118957672024Electronic Device Filled with Phase Change Material Between Plurality of Circuit Boards Connected by Connecting Members
Samsung Electronics Co., Ltd
0 cites - 0 cites
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- US118006882023Heat Dissipation Structure and Electronic Device Including Same
Samsung Electronics Co., Ltd.
0 cites - 0 cites
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- US116328812023Method for Controlling Cooling Fan and Wireless Charging Device
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US115556572023Electronic Device Having Heat Collection/diffusion Structure
Samsung Electronics Co., Ltd.
0 cites