Patents/Inventors

Kyung Suk Oh

Seongnam-siKR22 patents

23 Patents

US125002142025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US124828012025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US124697642025
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US123951732025
Integrated Circuit That Applies Different Data Interface Terminations During and After Write Data Reception
Rambus Inc.
0 cites
US123083632025
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US122493992025
On-die Termination of Address and Command Signals
RAMBUS Inc.
0 cites
US122322462025
Structure for Delivering Power
Rambus Inc.
0 cites
US122180702025
Semiconductor Package and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121660102024
Semiconductor Package and Method of Manufacturing the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US121423482024
Memory Device Comprising Programmable Command-and-address And/or Data Interfaces
Rambus Inc.
0 cites
US121425442024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US121257662024
Thermoelectric Cooling Packages
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120403042024
Semiconductor Package and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120025402024
On-die Termination of Address and Command Signals
RAMBUS Inc.
0 cites
US118879652024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US118826472024
Structure for Delivering Power
Rambus Inc.
0 cites
US118626182024
Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US118483082023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118375772023
System-in-package Module
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117838792023
Memory Device Comprising Programmable Command-and-address And/or Data Interfaces
Rambus Inc.
0 cites
US116884412023
On-die Termination of Address and Command Signals
RAMBUS Inc.
0 cites
US116643482023
Substrate Assembly Semiconductor Package Including the Same and Method of Manufacturing 1HE Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116370702023
Method of Fabricating a Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites