5 Patents
- US125557142026Device, Method, and System to Provide Passivation Structures of a Magnetic Material Based Inductor
Intel Corporation
0 cites - US121547152024Methods to Selectively Embed Magnetic Materials in Substrate and Corresponding Structures
Intel Corporation
0 cites - 0 cites
- US117355372023Methods to Embed Magnetic Material as First Layer on Coreless Substrates and Corresponding Structures
Intel Corporation
0 cites - US115812712023Methods to Pattern TFC and Incorporation in the ODI Architecture and in Any Build Up Layer of Organic Substrate
Intel Corporation
0 cites