Kyu-ha Shim

7 Patents

• US124577312025

  Bottom Contact Formation for 4F 2 Vertical DRAM

  Applied Materials, Inc.

  0 cites
• US124446152025

  Forming a Doped Hardmask

  Applied Materials, Inc.

  0 cites
• US121424752024

  Sequential Plasma and Thermal Treatment

  Applied Materials, Inc.

  0 cites
• US120947092024

  Plasma Treatment Process to Densify Oxide Layers

  APPLIED MATERIALS, Inc.

  0 cites
• US117283832023

  Localized Stressor Formation by Ion Implantation

  Applied Materials, Inc.

  0 cites
• US116644192023

  Isolation Method to Enable Continuous Channel Layer

  Applied Materials, Inc.

  0 cites
• US115944412023

  Handling for High Resistivity Substrates

  Applied Materials, Inc.

  0 cites