Patents/Inventors

Kyoungsei Choi

Yongin-siKR3 patents

4 Patents

US120626052024
Semiconductor Package Including an Interposer and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US117988892023
Methods of Manufacturing Semiconductor Packages
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116581072023
Semiconductor Package Including an Interposer and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115812632023
Semiconductor Package, and Package on Package Having the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites