8 Patents
- US125819782026Semiconductor Package Including Under Bump Metallization Pad
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US123880402025Semiconductor Package Including Redistribution Substrate and Method of Manufacturing the Same
Samsung Electronics Co., Ltd.
0 cites - 0 cites
- 0 cites
- US120402642024Semiconductor Package Including Under Bump Metallization Pad
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites
- US119554992024Image Sensor Package Including Glass Substrate and a Plurality of Redistribution Layers Disposed Below the Glass Substrate and Spaced Apart from Each Other by a Predetermined Distance
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - 0 cites