Patents/Inventors

Kyoung Lim Suk

Suwon-siKR19 patents

20 Patents

US125937372026
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US124944122025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US124532042025
Semiconductor Package and Method of Manufacturing the Same
Samsung Electronics Co., Ltd.
0 cites
US123947002025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US123811562025
Redistribution Substrate and Semiconductor Package Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122887802025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122611062025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122372562025
Semiconductor Package
SAMSUNG ELECTRONICS CO, Ltd.
0 cites
US121702512024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120149752024
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120150182024
Semiconductor Package with Multiple Redistribution Substrates
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US120093502024
Semiconductor Package and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118879312024
Semiconductor Package with Stepped Redistribution Structure Exposing Mold Layer
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118697752024
Semiconductor Packages
Samsung Electronics Co., Ltd.
0 cites
US118109152023
Semiconductor Package with Redistribution Substrate Having Embedded Passive Device
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118044272023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116949362023
Semiconductor Package and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116263932023
Semiconductor Package and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US116107852023
Semiconductor Packages
Samsung Electronics Co., Ltd.
0 cites
US116055842023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites