Patents/Inventors

Kyongsoon Cho

Suwon-siKR7 patents

7 Patents

US126106382026
Semiconductor Package and Method of Manufacturing the Semiconductor Package
Samsung Electronics Co., Ltd.
0 cites
US125325622026
Semiconductor Device Including Semiconductor Chips Stacked in a Multi-layer Structure by a Flip-chip Bonding Method
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US124714012025
Image Sensor Package
Samsung Electronics Co., Ltd.
0 cites
US123895452025
Semiconductor Packages Having Circuit Boards
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US122438862025
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118944052024
Image Sensor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115749432023
Semiconductor Package
SAMSUNG ELECTRONICS CO., Ltd.
0 cites