Kyle Whitten

4 Patents

• US123984802025

  Leveler Compositions for Use in Copper Deposition in Manufacture of Microelectronics

  Macdermid Enthone Inc.

  0 cites
• US122701212025

  Composition and Method for Fabrication of Nickel Interconnects

  Macdermid Enthone Inc.

  0 cites
• US118079512023

  Cobalt Chemistry for Smooth Topology

  Macdermid Enthone Inc.

  0 cites
• US116978842023

  Copper Deposition in Wafer Level Packaging of Integrated Circuits

  Macdermid Enthone Inc.

  0 cites