35 Patents
- US126223352026Exothermic Reactive Bonding for Semiconductor Die Assemblies and Associated Systems and Methods
Micron Technology, Inc.
0 cites - US126047552026Semiconductor Device Interconnects Formed Through Volumetric Expansion
Micron Technology, Inc.
0 cites - 0 cites
- US124698092025Semiconductor Interconnect Structures with Vertically Offset Bonding Surfaces, and Associated Systems and Methods
Micron Technology, Inc.
0 cites - US124514552025Systems and Methods for Direct Bonding in Semiconductor Die Manufacturing
Micron Technology, Inc.
0 cites - US124245172025Monolithic Conductive Cylinder in a Semiconductor Device and Associated Methods
Micron Technology, Inc.
0 cites - US124245162025Monolithic Conductive Column in a Semiconductor Device and Associated Methods
Micron Technology, Inc.
0 cites - US123811312025Front End of Line Interconnect Structures and Associated Systems and Methods
Micron Technology, Inc.
0 cites - US123681312025Embedded Nanoparticles for On-die Thermal Enhancement of Hybrid Bonding and Associated Systems and Methods
Micron Technology, Inc.
0 cites - US123344692025Piezoelectric Materials for On-die Thermal Enhancement of Hybrid Bonding and Associated Systems and Methods
Micron Technology, Inc.
0 cites - US123344482025Front End of Line Interconnect Structures and Associated Systems and Methods
Micron Technology, Inc.
0 cites - US123083482025Multi-height Interconnect Structures and Associated Systems and Methods
Micron Technology, Inc.
0 cites - 0 cites
- 0 cites
- US121837162024Monolithic Conductive Columns in a Semiconductor Device and Associated Methods
Micron Technology, Inc.
0 cites - US121070502024Front End of Line Interconnect Structures and Associated Systems and Methods
Micron Technology, Inc.
0 cites - US120740942024Monolithic Conductive Column in a Semiconductor Device and Associated Methods
Micron Technology, Inc.
0 cites - US120465592024Semiconductor Memory Stacks Connected to Processing Units and Associated Systems and Methods
Micron Technology, Inc.
0 cites - 0 cites
- US119730622024High Density Pillar Interconnect Conversion with Stack to Substrate Connection
Micron Technology, Inc.
0 cites - US119424442024Semiconductor Interconnect Structures with Vertically Offset Bonding Surfaces, and Associated Systems and Methods
Micron Technology, Inc.
0 cites - 0 cites
- US118625692024Front End of Line Interconnect Structures and Associated Systems and Methods
Micron Technology, Inc.
0 cites - US118239772023Semiconductor Devices with Back-side Coils for Wireless Signal and Power Coupling
Micron Technology, Inc.
0 cites - US118173052023Front End of Line Interconnect Structures and Associated Systems and Methods
Micron Technology, Inc.
0 cites - US117769262023Combination-bonded Die Pair Packaging and Associated Systems and Methods
Micron Technology, Inc.
0 cites - US117697382023Apparatuses Exhibiting Enhanced Stress Resistance and Planarity, and Related Microelectronic Devices and Memory Devices
Micron Technology, Inc.
0 cites - 0 cites
- US117355282023Semiconductor Memory Stacks Connected to Processing Units and Associated Systems and Methods
Micron Technology, Inc.
0 cites - US116316442023High Density Pillar Interconnect Conversion with Stack to Substrate Connection
Micron Technology, Inc.
0 cites - US115878952023Semiconductor Interconnect Structures with Vertically Offset Bonding Surfaces, and Associated Systems and Methods
Micron Technology, Inc.
0 cites - US115879122023High Density Pillar Interconnect Conversion with Stack to Substrate Connection
Micron Technology, Inc.
0 cites - US115692032023Multi-height Interconnect Structures and Associated Systems and Methods
Micron Technology, Inc.
0 cites