13 Patents
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- US120465362024Integrated Heat Spreader with Enhanced Vapor Chamber for Multichip Packages
Intel Corporation
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- US118814382024First-level Integration of Second-level Thermal Interface Material for Integrated Circuit Assemblies
Intel Corporation
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- US118429442023IC Assemblies Including Die Perimeter Frames Suitable for Containing Thermal Interface Materials
Intel Corporation
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- US116160002023Methods and Apparatus to Provide Electrical Shielding for Integrated Circuit Packages Using a Thermal Interface Material
Intel Corporation
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