Patents/Inventors

Kyeongbin Lim

SeoulKR3 patents

3 Patents

US125422282026
Die Alignment Method Using Magnetic Force
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US118375732023
Chip Bonding Apparatus and Method of Manufacturing Semiconductor Device Using the Apparatus
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US115811882023
Substrate Bonding Apparatus
Knu-lndustry Cooperation Foundation
0 cites