3 Patents
- US121912462025Chip-on-film Package Having Redistribution Pattern Between Semiconductor Chip and Connection Terminal
Samsung Electronics Co., Ltd.
0 cites - US121483372024Chip on Film Package with Trench to Reduce Slippage and Display Device Including the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites - US118308032023Chip-on-film Package Having Redistribution Pattern Between Semiconductor Chip and Connection Terminal
Samsung Electronics Co., Ltd.
0 cites