Patents/Inventors

Kwangmo Lim

Chandler, AZUS1 patent

2 Patents

US122180712025
Panel Level Packaging for Multi-die Products Interconnected with Very High Density (VHD) Interconnect Layers
Intel Corporation
0 cites
US117355312023
Panel Level Packaging for Multi-die Products Interconnected with Very High Density (VHD) Interconnect Layers
Intel Corporation
0 cites