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Inventors
Kwang Jin Moon
Hwaseong-si
KR
4 patents
4 Patents
US12543541
2026
Semiconductor Package with Nanotwin Copper Bond Pads
Samsung Electronics Co., Ltd.
0 cites
US12266609
2025
Semiconductor Device and Method for Fabricating the Same
Samsung Electronics Co., Ltd.
0 cites
US12249557
2025
Semiconductor Device Including Backside Wiring Structure with Super Via
SAMSUNG ELECTRONICS CO., Ltd.
0 cites
US12170259
2024
Semiconductor Package and Method of Fabricating the Same
SAMSUNG ELECTRONICS CO., Ltd.
0 cites