Kwan Wook Roh

7 Patents

• US126069282026

  Electroplating Systems and Methods with Increased Metal Ion Concentrations

  Applied Materials, Inc.

  0 cites
• US124045972025

  Electrochemical Depositions of Nanotwin Copper Materials

  Applied Materials, Inc.

  0 cites
• US121958672025

  Electrochemical Deposition Systems with Enhanced Crystallization Prevention Features

  Applied Materials, Inc.

  0 cites
• US119843582024

  Systems and Methods for Improving Within Die Co-planarity Uniformity

  Applied Materials, Inc.

  0 cites
• US119730342024

  Nanotwin Copper Materials in Semiconductor Devices

  Applied Materials, Inc.

  0 cites
• US116860052023

  Electroplating Systems and Methods with Increased Metal Ion Concentrations

  Applied Materials, Inc.

  0 cites
• US116348302023

  Electrochemical Depositions of Nanotwin Copper Materials

  Applied Materials, Inc.

  0 cites