13 Patents
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- US121319762024Semiconductor Structure with Heat Dissipation Structure and Method of Fabricating the Same
UNITED MICROELECTRONICS Corp.
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- US116580872023High Resistivity Wafer with Heat Dissipation Structure and Method of Making the Same
UNITED MICROELECTRONICS Corp.
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- US116520172023High Resistivity Wafer with Heat Dissipation Structure and Method of Making the Same
UNITED MICROELECTRONICS Corp.
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