29 Patents
- US125576232026Semiconductor Device with Connecting Structure Having a Doped Layer and Method for Forming the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US125385442026Method for Manufacturing Semiconductor Device
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US124842402025Semiconductor Device and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US124329632025Device Having an Air Gap Adjacent to a Contact Plug and Covered by a Doped Dielectric Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US124190992025Method for Manufacturing Semiconductor Device
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US123680982025Methods of Forming Semiconductor Device
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123007402025Metal Layer Protection During Wet Etching
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US122781412025Semiconductor Devices and Methods of Manufacture
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US122439402025Methods of Forming Air Spacers in Semiconductor Devices
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - 0 cites
- US121836322024Bottom Lateral Expansion of Contact Plugs Through Implantation
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US121129772024Reducing Spacing Between Conductive Features Through Implantation
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US120681952024Metal Loss Prevention Using Implantation
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120150552024Doping for Semiconductor Device with Conductive Feature
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US120093052024Semiconductor Device and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US119844912024Metal Layer Protection During Wet Etching
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US119730272024Semiconductor Device and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US119087402024Semiconductor Structure with Doped via Plug
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119014552024Method of Manufacturing a Finfet by Implanting a Dielectric with a Dopant
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - 0 cites
- US118548702023Etch Method for Interconnect Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US117912042023Semiconductor Device with Connecting Structure Having a Doped Layer and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US117423862023Doping for Semiconductor Device with Conductive Feature
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US117106592023Metal Loss Prevention Using Implantation
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US116827292023Methods of Forming Air Spacers in Semiconductor Devices
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US116520532023Semiconductor Device and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US116159822023Reducing Spacing Between Conductive Features Through Implantation
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - 0 cites