53 Patents
- US125990112026Semiconductor Structure and Method for Forming the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US125435692026Package with Improved Heat Dissipation Efficiency and Method for Forming the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US125436042026Adding Sealing Material to Wafer Edge for Wafer Bonding
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US125061152025Multi-die Package Structures Including Redistribution Layers
Parabellum Strategic Opportunities Fund LLC
0 cites - US124944552025Multi-die Package Structures Including an Interconnected Package Component Disposed in a Substrate Cavity
Parabellum Strategic Opportunities Fund LLC
0 cites - 0 cites
- US124313662025Structure Having Thermal Dissipation Structure Therein and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123746022025Semiconductor Structure Having Through Substrate via and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123622622025Semiconductor Device Including Through Die Via
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123477852025Semiconductor Structure and Method Manufacturing the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US123410792025Package Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123157842025Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123158312025Package Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US123006462025Chiplets 3 D Soic System Integration and Fabrication Methods
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US122939912025Semiconductor Packages and Methods of Forming Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US122726132025Thermal Structure for Semiconductor Device and Method of Forming the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US122611422025Semiconductor Structure Including Thermal Enhanced Bonding Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- 0 cites
- US122180892025Packaged Semiconductor Device and Method of Forming Thereof
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US122090152025MEMS Packages and Methods of Manufacture Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US121990652025Multi-die Package Structures Including Redistribution Layers
Parabellum Strategic Opportunities Fund LLC
0 cites - US121912792025Integrated Circuit Packages and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US121425972024Integrated Fan-out Package and the Methods of Manufacturing
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120806152024Method of Manufacturing an Integrated Fan-out Package Having Fan-out Redistribution Layer (RDL) to Accommodate Electrical Connectors
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120574062024Package Having Redistribution Layer Structure with Protective Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US120339762024Semiconductor Package Having a Through Intervia Through the Molding Compound and Fan-out Redistribution Layers Disposed Over the Respective Die of the Stacked Fan-out System-in-package
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US120149932024Package Having Redistribution Layer Structure with Protective Layer and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119786912024Semiconductor Device and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119617892024Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119357602024Package Structure Having Thermal Dissipation Structure Therein and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119293452024Semiconductor Device Including Binding Agent Adhering an Integrated Circuit Device to an Interposer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119160282024Package Structure and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US118550202023Chiplets 3D Soic System Integration and Fabrication Methods
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - 0 cites
- US118044572023Package Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US117496072023Package and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117282172023Wafer Level Package Structure and Method of Forming Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US116949432023Semiconductor Device Including Heat Dissipation Structure and Fabricating Method of the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US116856482023MEMS Packages and Methods of Manufacture Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US116826292023Package Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US116580442023Thermally Conductive Structure for Heat Dissipation in Semiconductor Packages
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US116580972023Manufacturing Method for Semiconductor Device Including Through Die Hole
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US116370842023Semiconductor Package Having a Through Intervia Through the Molding Compound and Fan-out Redistribution Layers Disposed Over the Respective Die of the Stacked Fan-out System-in-package
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US115812812023Packaged Semiconductor Device and Method of Forming Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - 0 cites
- US115748862023Thermally Conductive Molding Compound Structure for Heat Dissipation in Semiconductor Packages
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites