Patents/Inventors

Kunzhong Hu

Cupertino, CAUS24 patents

23 Patents

US125884942026
Die Stitching and Harvesting of Arrayed Structures
Apple Inc.
0 cites
US125504122026
Structure and Method for Fabricating a Computing System with an Integrated Voltage Regulator Module
Apple Inc.
0 cites
US124697652025
Thermally Enhanced Chip-on-wafer or Wafer-on-wafer Bonding
Apple Inc.
0 cites
US123681372025
High Bandwidth Die to Die Interconnect with Package Area Reduction
Apple Inc.
0 cites
US123227302025
Wafer Reconstitution and Die-stitching
Apple Inc.
0 cites
US122835492025
High Density Interconnection Using Fanout Interposer Chiplet
Apple Inc.
0 cites
US122611322025
Structure and Method for Sealing a Silicon IC
Apple Inc.
0 cites
US122495992025
Multiple Chip Module Trenched Lid and Low Coefficient of Thermal Expansion Stiffener Ring
Apple Inc.
0 cites
US121598352024
High Density 3D Interconnect Configuration
Apple Inc.
0 cites
US121193042024
Very Fine Pitch and Wiring Density Organic Side by Side Chiplet Integration
Apple Inc.
0 cites
US120876892024
Selectable Monolithic or External Scalable Die-to-die Interconnection System Methodology
Apple Inc.
0 cites
US119675282024
Structure and Method for Fabricating a Computing System with an Integrated Voltage Regulator Module
Apple Inc.
0 cites
US118625572024
Selectable Monolithic or External Scalable Die-to-die Interconnection System Methodology
Apple Inc.
0 cites
US118313122023
Systems and Methods for Implementing a Scalable System
Apple Inc.
0 cites
US118240152023
Structure and Method for Sealing a Silicon IC
Apple Inc.
0 cites
US117496312023
Electronic Package Including a Hybrid Thermal Interface Material and Low Temperature Solder Patterns to Improve Package Warpage and Reliability
Apple Inc.
0 cites
US117355262023
High Density 3D Interconnect Configuration
Apple Inc.
0 cites
US117355672023
Wafer Reconstitution and Die-stitching
Apple Inc.
0 cites
US117282662023
Die Stitching and Harvesting of Arrayed Structures
Apple Inc.
0 cites
US116705482023
Structure and Method for Fabricating a Computing System with an Integrated Voltage Regulator Module
Apple Inc.
0 cites
US116463022023
Multiple Chip Module Trenched Lid and Low Coefficient of Thermal Expansion Stiffener Ring
Apple Inc.
0 cites
US115944942023
High Density Interconnection Using Fanout Interposer Chiplet
Apple Inc.
0 cites
US115879092023
High Bandwidth Die to Die Interconnect with Package Area Reduction
Apple Inc.
0 cites