Kunsil Lee

5 Patents

• US125754662026

  Semiconductor Package and Method of Fabricating the Same

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US124009982025

  Semiconductor Package Including Plurality of Semiconductor Chips and Method for Manufacturing the Same

  Samsung Electronics Co., Ltd.

  0 cites
• US119358682024

  Semiconductor Package Including Plurality of Semiconductor Chips and Method for Manufacturing the Same

  Samsung Electronics Co., Ltd.

  0 cites
• US119087272024

  Support Substrates, Methods of Fabricating Semiconductor Packages Using the Same, and Methods of Fabricating Electronic Devices Using the Same

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US116316082023

  Support Substrates, Methods of Fabricating Semiconductor Packages Using the Same, and Methods of Fabricating Electronic Devices Using the Same

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites