Kunmo Chu

3 Patents

• US123706322025

  Metal Particle for Adhesive Paste, Method of Preparing the Same, Solder Paste Including the Same, Composite Bonding Structure Formed Therefrom, and Semiconductor Device Including the Composite Bonding Structure

  Samsung Electronics Co., Ltd.

  0 cites
• US122887652025

  Hybrid Bonding Structures, Semiconductor Devices Having the Same, and Methods of Manufacturing the Semiconductor Devices

  Samsung Electronics Co., Ltd.

  0 cites
• US118044622023

  Hybrid Bonding Structures and Semiconductor Devices Including the Same

  Samsung Electronics Co., Ltd.

  0 cites