3 Patents
- US126107992026Coating Method for Making Chip, Chip Substrate, and Chip
TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
0 cites - US125989672026Through Silicon via Interconnection Structure and Method of Forming Same, and Quantum Computing Device
Tencent Technology (Shenzhen) Company Limited
0 cites - US125506262026Method for Preparing Josephson Junction and Production Line Device
Tencent Technology (Shenzhen) Company Limited
0 cites