Patents/Inventors

Kunihiko Akai

TokyoJP3 patents

4 Patents

US122463982025
Solder Bump Forming Member, Method for Manufacturing Solder Bump Forming Member, and Method for Manufacturing Electrode Substrate Provided with Solder Bump
RESONAC CORPORATION
0 cites
US122472702025
Anisotropic Conductive Film and Method for Producing the Anisotropic Conductive Film Including a Base Material Having Recesses and Solder Particles Formed Inside the Recesses
RESONAC CORPORATION
0 cites
US121722402024
Solder Particles
RESONAC CORPORATION
0 cites
US121009232024
Connection Structure and Manufacturing Method Therefor
RESONAC CORPORATION
0 cites