Kuniharu Ogawa

2 Patents

• US123311822025

  Resin Composition and Resin-attached Copper Foil

  MITSUI MINING & SMELTING CO., Ltd.

  0 cites
• US123312122025

  Resin Composition, Copper Foil with Resin, and Printed Wiring Board

  MITSUI MINING & SMELTING CO., Ltd.

  0 cites