Patents/Inventors

Kung-chen Yeh

Taichung CityTW6 patents

5 Patents

US125990312026
Semiconductor Package and Method
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US123811772025
Package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121193242024
Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119904292024
Dummy Die Placement Without Backside Chipping
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US119488962024
Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites