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Kun-che Wu
Taichung City
TW
3 patents
3 Patents
US12581647
2026
Memory Device and Method of Manufacturing the Same
WINBOND ELECTRONICS Corp.
0 cites
US12456639
2025
Pick-up Structure for Memory Device and Manufacturing Method Thereof
WINDBOND ELECTRONICS Corp.
0 cites
US11545360
2023
Semiconductor Device and Manufacturing Method of the Same
Winbond Electronics Corp.
0 cites