Kuei-wei Chen

3 Patents

• US119730952024

  Method for Forming Chip Package with Second Opening Surrounding First Opening Having Conductive Structure Therein

  XINTEC Inc.

  0 cites
• US119425632024

  Manufacturing Method of Chip Package and Chip Package

  XINTEC Inc.

  0 cites
• US117053682023

  Manufacturing Method of Chip Package and Chip Package

  XINTEC Inc.

  0 cites