Patents/Inventors

Kuan-liang Liu

HsinchuTW21 patents

20 Patents

US126108102026
Semiconductor Structure and Method of Manufacturing the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites
US125819232026
Method for Removing Edge of Substrate in Semiconductor Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US124713792025
Multi-function Substrate
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124084302025
Semiconductor-on-insulator Wafer Having a Composite Insulator Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123603142025
Photonic Semiconductor-on-insulator (SOI) Substrate and Method for Forming the Photonic SOI Substrate
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123026372025
Semiconductor Wafer with Devices Having Different Top Layer Thicknesses
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122133232025
Embedded Backside Memory on a Field Effect Transistor
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121659112024
Method for Forming a Semiconductor-on-insulator (SOI) Substrate
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121598732024
Semiconductor Structure and Manufacturing Method Thereof
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites
US121130712024
Multi-function Substrate
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120876352024
Transistor Structure
United Microelectronics Corp.
0 cites
US119250332024
Embedded Backside Memory on a Field Effect Transistor
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118879872024
Semiconductor Wafer with Devices Having Different Top Layer Thicknesses
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US118429922023
Seal Ring Structures and Methods of Forming Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118307642023
Method for Forming a Semiconductor-on-insulator (SOI) Substrate
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117423212023
Apparatus for Bond Wave Propagation Control
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117215872023
Transistor Structure
UNITED MICROELECTRONICS Corp.
0 cites
US117106562023
Method of Forming Semiconductor-on-insulator (SOI) Substrate
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US116769692023
Semiconductor-on-insulator Wafer Having a Composite Insulator Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US115454432023
Method for Forming Hybrid-bonding Structure
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites