Patents/Inventors

Kristof Darmawikarta

Chandler, AZUS60 patents

52 Patents

US126047482026
Capacitor Pads and Methods of Manufacturing the Same
Intel Corporation
0 cites
US125688312026
Patternable Die Attach Materials and Processes for Patterning
Intel Corporation
0 cites
US125607712026
Die First Fan-out Architecture for Electric and Optical Integration
Intel Corporation
0 cites
US125410672026
Substrate Cavity with Stepped Walls
Intel Corporation
0 cites
US125435782026
Electronic Packaging Architecture with Customized Variable Metal Thickness on Same Buildup Layer
Intel Corporation
0 cites
US125045812025
Photonic Interconnect and Components in Glass
Intel Corporation
0 cites
US124985202025
Integrated Optical Coupler
Intel Corporation
0 cites
US124944432025
Substrate Integrated Thin Film Capacitors Using Amorphous High-k Dielectrics
Intel Corporation
0 cites
US124761752025
Glass Substrates Having Transverse Capacitors for Use with Semiconductor Packages and Related Methods
Intel Corporation
0 cites
US123530702025
Glass Interposer Optical Switching Device and Method
Intel Corporation
0 cites
US123548832025
Omni Directional Interconnect with Magnetic Fillers in Mold Matrix
Intel Corporation
0 cites
US123549312025
Optimization for Raster Scanning
Intel Corporation
0 cites
US123549632025
Lithographic Cavity Formation to Enable EMIB Bump Pitch Scaling
Intel Corporation
0 cites
US123459322025
Die Last and Waveguide Last Architecture for Silicon Photonic Packaging
Intel Corporation
0 cites
US123477882025
Glass Substrates Having Signal Shielding for Use with Semiconductor Packages and Related Methods
Intel Corporation
0 cites
US123492822025
Capacitors in Through Glass Vias
Intel Corporation
0 cites
US123344432025
Lithographic Cavity Formation to Enable EMIB Bump Pitch Scaling
Intel Corporation
0 cites
US123344472025
Lithographically Defined Vertical Interconnect Access (VIA) for a Bridge Die First Level Interconnect (FLI)
0 cites
US123064802025
Glass Interposer Optical Resonator Device and Method
Intel Corporation
0 cites
US123006132025
Die Interconnect Substrate, an Electrical Device and a Method for Forming a Die Interconnect Substrate
Intel Corporation
0 cites
US123006202025
Inorganic-based Embedded-die Layers for Modular Semiconductive Devices
Intel Corporation
0 cites
US122724842025
Coreless Electronic Substrates Having Embedded Inductors
Intel Corporation
0 cites
US122537222025
Magneto-optical Kerr Effect Interconnects for Photonic Packaging
Intel Corporation
0 cites
US122304302025
Substrate Embedded Magnetic Core Inductors and Method of Making
Intel Corporation
0 cites
US122180402025
Nested Interposer with Through-silicon via Bridge Die
Intel Corporation
0 cites
US122180692025
Multi-chip Package with High Density Interconnects
Intel Corporation
0 cites
US122180712025
Panel Level Packaging for Multi-die Products Interconnected with Very High Density (VHD) Interconnect Layers
Intel Corporation
0 cites
US121659942024
Radio Frequency Antennas and Waveguides for Communication Between Integrated Circuit Devices
Intel Corporation
0 cites
US120465602024
Microelectronic Device with Embedded Die Substrate on Interposer
Intel Corporation
0 cites
US120402762024
Device and Method of Very High Density Routing Used with Embedded Multi-die Interconnect Bridge
Intel Corporation
0 cites
US120149892024
Device and Method of Very High Density Routing Used with Embedded Multi-die Interconnect Bridge
Intel Corporation
0 cites
US119488982024
Etch Barrier for Microelectronic Packaging Conductive Structures
Intel Corporation
0 cites
US119292122024
Method to Form High Capacitance Thin Film Capacitors (tfcs) as Embedded Passives in Organic Substrate Packages
Intel Corporation
0 cites
US119293302024
Lithographic Cavity Formation to Enable EMIB Bump Pitch Scaling
Intel Corporation
0 cites
US119233122024
Patternable Die Attach Materials and Processes for Patterning
Intel Corporation
0 cites
US119088022024
Multi-chip Package with High Density Interconnects
Intel Corporation
0 cites
US119088212024
Sacrificial Dielectric for Lithographic via Formation to Enable via Scaling in High Density Interconnect Packaging
Intel Corporation
0 cites
US119012962024
Die Interconnect Substrate, an Electrical Device and a Method for Forming a Die Interconnect Substrate
Intel Corporation
0 cites
US118943112024
Microelectronic Device with Embedded Die Substrate on Interposer
Intel Corporation
0 cites
US118943242024
In-package RF Waveguides as High Bandwidth Chip-to-chip Interconnects and Methods for Using the Same
Intel Corporation
0 cites
US118626192024
Patch Accommodating Embedded Dies Having Different Thicknesses
Intel Corporation
0 cites
US118375342023
Substrate with Variable Height Conductive and Dielectric Elements
Intel Corporation
0 cites
US118044552023
Substrate Integrated Thin Film Capacitors Using Amorphous High-k Dielectrics
Intel Corporation
0 cites
US117988872023
Inorganic-based Embedded-die Layers for Modular Semiconductive Devices
Intel Corporation
0 cites
US117912282023
Method for Forming Embedded Grounding Planes on Interconnect Layers
Intel Corporation
0 cites
US117841282023
Die Interconnect Substrate, an Electrical Device and a Method for Forming a Die Interconnect Substrate
Intel Corporation
0 cites
US117355312023
Panel Level Packaging for Multi-die Products Interconnected with Very High Density (VHD) Interconnect Layers
Intel Corporation
0 cites
US117282582023
Electroless Metal-defined Thin Pad First Level Interconnects for Lithographically Defined Vias
Intel Corporation
0 cites
US116996482023
Electromigration Resistant and Profile Consistent Contact Arrays
Tahoe Research, Ltd.
0 cites
US116058672023
Fabricating an RF Filter on a Semiconductor Package Using Selective Seeding
Intel Corporation
0 cites
US115748742023
Package Architecture Utilizing Photoimageable Dielectric (PID) for Reduced Bump Pitch
Intel Corporation
0 cites
US115520102023
Dielectric for High Density Substrate Interconnects
Intel Corporation
0 cites