Krishna Vasanth Valavala

6 Patents

• US125819382026

  Package Architecture for Quasi-monolithic Chip with Backside Power

  Intel Corporation

  0 cites
• US123477802025

  Integrated Circuit Package with Flipped High Bandwidth Memory Device

  Intel Corporation

  0 cites
• US117568562023

  Package Architecture Including Thermoelectric Cooler Structures

  Intel Corporation

  0 cites
• US116949422023

  Annular Silicon-embedded Thermoelectric Cooling Devices for Localized On-die Thermal Management

  Intel Corporation

  0 cites
• US116642932023

  Solid State Thermoelectric Cooler in Silicon Backend Layers for Fast Cooling in Turbo Scenarios

  Intel Corporation

  0 cites
• US116580952023

  Bump Integrated Thermoelectric Cooler

  Intel Corporation

  0 cites