Patents/Inventors

Koustav Sinha

Boise, IDUS16 patents

14 Patents

US125881472026
Filling Cracks on a Substrate Via
Micron Technology, Inc.
0 cites
US125435722026
Semiconductor Systems with Anti-warpage Mechanisms and Associated Systems, Devices, and Methods
Micron Technology, Inc.
0 cites
US123411102025
Methods and Apparatus for Using Structural Elements to Improve Drop/shock Resilience in Semiconductor Devices
Micron Technology, Inc.
0 cites
US122691062025
Two-step Solder-mask-defined Design
0 cites
US122180792025
Semiconductor Devices with Reinforced Substrates
Micron Technology, Inc.
0 cites
US122118142025
Semiconductor Interconnect Structures with Conductive Elements, and Associated Systems and Methods
Micron Technology, Inc.
0 cites
US122118222025
Stacked Semiconductor Die Assemblies with Substrate Heat Sinks and Associated Systems and Methods
Micron Technology, Inc.
0 cites
US119088032024
Semiconductor Devices with Flexible Connector Array
Micron Technology, Inc.
0 cites
US118698622024
Microelectronic Components Including Metal Pillars Secured to Bond Pads, and Related Methods, Assemblies, and Systems
Micron Technology, Inc.
0 cites
US117697522023
Stacked Semiconductor Die Assemblies with Substrate Heat Sinks and Associated Systems and Methods
Micron Technology, Inc.
0 cites
US117283072023
Semiconductor Interconnect Structures with Conductive Elements, and Associated Systems and Methods
Micron Technology, Inc.
0 cites
US116643602023
Circuit Board with Spaces for Embedding Components
Micron Technology, Inc.
0 cites
US116462862023
Processes for Forming Self-healing Solder Joints and Repair of Same, Related Solder Joints, and Microelectronic Components, Assemblies and Electronic Systems Incorporating Such Solder Joints
Micron Technology, Inc.
0 cites
US115520292023
Semiconductor Devices with Reinforced Substrates
Micron Technology, Inc.
0 cites