1 Patent
- US125388112026Semiconductor Device Comprising an Electrode Terminal and an Electrode Exposed in an Opening Provided in a Mold Resin, Semiconductor Device Group Comprising an Electrode Terminal and an Electrode Exposed in an Opening Provided in a Mold Resin, and Power Conversion Apparatus Comprising an Electrode Terminal and an Electrode Exposed in an Opening Provided in a Mold Resin
Mitsubishi Electric Corporation
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