Kok Wai Chan

8 Patents

• US122049952025

  Method and Arrangement for Resetting Qubits

  IQM FINLAND OY

  0 cites
• US121503882024

  Electroplating for Vertical Interconnections

  IQM Finland Oy

  0 cites
• US120741142024

  Chip Fabrication Method and Product Including Raised and Recessed Alignment Structures

  IQM Finland OY

  0 cites
• US120133232024

  Sample Cell for Handling and Measuring Sensitive Samples in Low Temperature Conditions

  IQM Finland Oy

  0 cites
• US119078052024

  Three-dimensional Superconducting Qubit and a Method for Manufacturing the Same

  IQM Finland Oy

  0 cites
• US118496512023

  Superconducting Device

  IQM Finland Oy

  0 cites
• US116213882023

  Method for Manufacturing Josephson Junctions

  IQM Finland Oy

  0 cites
• US116055862023

  Airbridge for Making Connections on Superconducting Chip, and Method for Producing Superconducting Chips with Airbridges

  IQM Finland Oy

  0 cites