Koji Nishioka

5 Patents

• US122179482025

  Sputtering Target, Method of Bonding Target Material and Backing Plate, and Method of Manufacturing Sputtering Target

  SUMITOMO CHEMICAL COMPANY, LIMITED

  0 cites
• US120573022024

  Backing Plate, Sputtering Target, and Production Methods Therefor

  SUMITOMO CHEMICAL COMPANY, LIMITED

  0 cites
• US120515772024

  Sputtering Target, Method of Bonding Target Material and Backing Plate, and Method of Manufacturing Sputtering Target

  SUMITOMO CHEMICAL COMPANY, LIMITED

  0 cites
• US117667262023

  Method for Machining Sputtering Target, Apparatus for Machining Sputtering Target, Sputtering Target, and Method for Producing Sputtering Target Product

  SUMITOMO CHEMICAL COMPANY, LIMITED

  0 cites
• US117312302023

  Method for Manufacturing Sputtering Target and Sputtering Target

  SUMITOMO CHEMICAL COMPANY, LIMITED

  0 cites